When LED CHIP industry entered the led lighting era, the pressure of led chip price never stopped. and it is constantly looking for new opportunities. At present, LED manufacturers in Europe, America, mainland China and Taiwan are competing to develop unpackaged chips. Unpackaged chip technology is undoubtedly 2013. A major focus of the industry.
As far as the LED lighting products are concerned, the manufacturing process is divided into Level0 to Level5. Among them, Level0 is the process of epitaxial and chip, while Level1 encapsulates the LED chip, Level2 is the LED on the PCB, and Level3 is the LED module. Level 4 is the lighting source and Level 5 is the lighting system. The LED factory has no packaged chip technology and has omitted the development of Level1.
CREE and Philips Lumileds are also actively proclaiming the research and development results of CSP products. Philips Lumileds' LUXEONQ adopts flipchip technology, which eliminates the need to remove sapphire substrates in the back-end process, and locks directly to replace the popular and mature 3535 package specifications on the market.
CREE's XQ-ELED products also use CSP technology, which greatly reduces the chip area, and has the same lighting level performance as XP-E2, while the size is reduced by 78, only 1.6mm*1.6mm, and its miniaturized design can enhance the light tone. Color quality and optical control expand the range of lighting applications.
Taiwan LED chip factory is also active in the development of unpackaged chip products. The new ELC product adopts semiconductor manufacturing process, which will save the package (Level1) part, including the past lead frame and wire bonding, leaving only the chip It is used with phosphors and encapsulants, and can be used in direct placement (SMT). It is reported that crystal ELC products have entered the backlight supply chain and will be used in the lighting market in the future.
Yuyuan has also developed PFC package-free products. The chip design based on flipchip does not need to be wired. The advantage of PFC package-free chip products is that the light efficiency is improved to 200lm/W, and the super wide-angle full-period design with illumination angle greater than 300 degrees. In addition, the secondary optical lens can be eliminated, which will reduce the wear and cost of the light effect.
The TSMC solid-state lighting is called PoD (Phosphorondie), and the flipchip chip is directly placed on the heat-dissipating substrate, omitting the steps of the lead frame and the wire, and the main small size has a higher Luminous flux, with a large angle of illumination, and easier to mix and adjust color temperature characteristics, suitable for non-directional light source applications.
The trend of continuous low-cost LEDs has also led manufacturers to think about ways to reduce production costs. Naturally, no packaging is also taken into account.
Including Taiwan's LED chip factory Jingdian, Yuyuan, one-stop factory TSMC solid-state lighting, Ronda, international manufacturers Toshiba, CREE, PhilipsLumileds are actively engaged in the development and production of unpackaged products.
In view of the unpackaged products currently being introduced by LED chip factories and one-stop factories, the non-packaged products of Jingdian are mainly driven by ELC (EmbeddedLEDChip). After the chip production in the process, only the phosphors and the encapsulant are needed, The lead frame and the wire step can be used for direct mounting (SMT). The ELC product has a large illumination angle without the lead frame, and there is a chance to omit the use of the secondary optical lens in the future.
However, most unpackaged products are still in the stage of only smelling the stairs, and the production rate of unpackaged products is affecting the mass production of this product.
LABELS: Led chip; Led chips; Led package; LED LAMP; LED LAMPS; Light Emitting Diode.
