COB packaging technology still faces three challenges, but these challenges are gradually improved with the continuous efforts of led chips manufacturers. The LED CHIP electronic moisture-proof box can effectively reduce the humidity inside the space by using effective dehumidification and dehumidification technology in the effective airtight and effective space to achieve moisture, mildew, oxidation, rust, anti-deterioration and prevention. Requirement functions such as qualitative change, such cabinet equipment is called LED chip moisture-proof drying cabinet or LED chip electronic moisture-proof cabinet.
1. One pass rate of the packaging process:
COB package method Because of its characteristics, the COB package is on a large board. This board has a maximum of 1024 lights. If the SMD seals a lamp, you only need to change one, but the 1024 of the COB package. After the lamp package is completed, the test is performed, and all the lamps are confirmed to have no problem before the seal can be applied. How to ensure that the entire board of 1024 lights is completely intact, one pass rate is a very big challenge.
2. The finished product pass rate:
The COB product is first sealed. After the lamp is sealed, the IC driver device is subjected to a reflow process. How to ensure that the lamp surface is over-reflowed, the high temperature of 240 degrees in the furnace does not damage the lamp. This is another big challenge. Compared with SMD, COB saves the surface reflow soldering process, but the device surface needs to be reflow soldered like SMD, which means that SMD has to be reflowed twice. When SMD is reflowed, the temperature in the furnace will cause two kinds of damage to the lamp surface. One is the wire. If the temperature is too high, it will rapidly expand rapidly, which will cause the filament to break. The second one is The heat in the furnace is quickly transmitted to the wick through the four pins of the bracket. The wick may cause small fragmentation damage. This damage is fatal, and the detection is often difficult to detect, including aging tests are difficult to detect, but This fine damage to the crystals, after a period of use, will be highlighted, which will lead to lamp failure. The COB is to ensure that when the lamp surface is over-reflowed, the high temperature in the furnace does not cause damage to it, and the yield is guaranteed. This is also a very important aspect.
3. The whole lamp repair:
For the maintenance of COB lamps, professional maintenance and maintenance are required. One of the biggest problems with single-lamp maintenance is that after repairing, a circle will appear around the lamp, and a lamp will be repaired. The surrounding circle will be smoked by the welding torch, and the maintenance difficulty is relatively high.
If there are challenges, it is necessary to find a corresponding solution. At present, the problems encountered in the packaging and maintenance process of the COB package are solved by the enterprise. For example, when the lamp surface is over-reflowed, a certain solution is adopted. The way to protect the lamp surface to reduce damage; the point-by-point correction technology is used in the maintenance process to ensure the consistency between the lamp beads.
Label: Three problems in COB packaging - LED chip moisture-proof drying cabinet
