1. LED chip is a solid-state semiconductor device that directly converts electricity into light. The heart of the LEDs is a semiconductor chip, The end is attached to a bracket, one end is a negative pole, and the other end is connected to the positive pole of the power source, so that the entire chip is encapsulated by epoxy resin. The semiconductor chip consists of two parts, one part is a P -type semiconductor, in which the hole dominates, and the other end is an N -type semiconductor, which is mainly electrons here. But when the two semiconductors are connected, they form a PN junction. When current is applied to the chip through the wire, the electrons are pushed to the P region. In the P region, the electrons are combined with the holes, and then the energy is emitted in the form of photons. This is the principle of LED illumination. The wavelength of light, which is the color of light, is determined by the material that forms the PN junction. The main raw material of the LED chip of the LED, LED chips to emit light mainly rely.
The LED chip is on the epitaxial wafer and flows through the following series
Cheng, the final completion of the finished - chip as shown on the right .
Epitaxial wafer→Cleaning→ Indium Tin Oxide ( ITO ) →Transparent Electrode Pattern Lithography→Corrosion→Debonding→
Platform graphic lithography → dry etching → stripping → annealing →
SiO2 deposition→window pattern lithography→ SiO2 corrosion→debonding→
N- pole pattern lithography → pre-cleaning → coating → stripping → annealing →
P- pole pattern lithography → coating → peeling → grinding → cutting →
Chip → finished product testing.
2 , the elements of the LED chip
The elements of the LED chip are mainly III-V elements, mainly arsenic (AS) , aluminum (AL) , gallium (Ga , ) indium (IN) , phosphorus (P) ,
Several of the elements of nitrogen (N) and cerium (Si) .
3 , LED chip classification
1 ) According to the brightness of the light
A, general brightness: R ( red GaAsP 655nm) , H ( high red GaP 697nm) , G ( green GaP 565nm ) ,
Y ( yellow GaAsP/GaP 585nm) , E ( orange GaAsP/GaP 635nm), etc.
B , high brightness: VG ( lighter green GaP 565nm) , VY ( lighter yellow GaAsP / GaP 585nm) ,
SR ( lighter red GaA/AS 660nm) ;
C , super high brightness: UG , UY , UR , UYS , URF , UE, etc.
D , invisible light ( infrared ) : R , SIR , VIR , HIR
E , infrared receiver tube: PT
F , photocell: PD
2 ) by component
A , binary wafer ( phosphorus, gallium ) : H , G, etc.
B , ternary wafer (phosphorus, gallium, arsenic): SR ( bright red GaA/AS 660nm) , HR ( super bright red GaAlAs 660nm)
UR ( brightest red GaAlAs 660nm), etc.
C , quaternary wafer ( phosphorus, aluminum, gallium, indium ) : SRF ( bright red AlGalnP) , HRF ( super bright red AlGalnP) ,
URF ( brightest red AlGalnP 630nm) , VY ( brighter yellow GaAsP/GaP 585nm) ,
HY ( super bright yellow AlGalnP 595nm) , UY ( brightest yellow AlGalnP 595nm) ,
UYS ( brightest yellow AlGalnP 587nm) , UE ( brightest orange AlGalnP 620nm) ,
HE ( super bright orange AlGalnP 620nm) , UG ( brightest green AIGalnP 574nm), etc.
3 ) According to the production process
LED chips are divided into four types : MB chip, GB chip, TS chip, AS chip, etc.
Labels: led chip, led chips, LED LAMP, LED LAMPS, led package.
